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Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints
Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints
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机译：抑制焊点中镍-铜-锡金属间化合物层生长的方法
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摘要
A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)3Sn4) layer at the (Cu,Ni)6Sn5/nickel interface of a solder joint is described as follows. A Sn—Ag—Cu solder alloy with a Cu-content of 0.5˜1 weight percent (wt. %) is provided. The solder alloy is disposed on a surface finish of a soldering pad, having a nickel-based metallization layer. A material of the solder alloy further includes palladium. The solder alloy is joined with the surface finish, so as to form the solder joint containing palladium that enables to inhibit the growth of the undesired (Ni,Cu)3Sn4 layer between the (Cu,Ni)6Sn5 and nickel in the subsequent use at temperatures ranging from 100° C. to 180° C.
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机译：一种抑制（Cu，Ni）处镍-铜-锡金属间化合物（Ni，Cu） 3 Sn 4 ）层生长的方法焊点的6 Sn 5 /镍界面描述如下。提供具有0.5〜1重量百分比（wt。％）的Cu含量的Sn-Ag-Cu焊料合金。焊料合金设置在具有镍基金属化层的焊盘的表面光洁度上。焊料合金的材料还包括钯。将焊料合金与表面处理层接合在一起，以形成包含钯的焊料接合点，从而能够抑制不希望的（Ni，Cu） 3 Sn 4 的生长（Cu，Ni） 6 Sn 5 和镍之间的层，随后在100°C至180°C的温度范围内使用。
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