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Embedded photodetector apparatus in a 3D CMOS chip stack
Embedded photodetector apparatus in a 3D CMOS chip stack
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机译:3D CMOS芯片堆栈中的嵌入式光电探测器设备
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摘要
An embedded photodetector apparatus for a three-dimensional complementary metal oxide semiconductor (CMOS) stacked chip assembly having a CMOS chip and one or more thinned CMOS layers is provided. At least one of the one or more thinned CMOS layers includes an active photodiode area defined within the one or more thinned CMOS layers, the active photodiode area being receptive of an optical signal incident thereon, and the active photodiode area comprising a bulk substrate portion of the thinned CMOS layer. The bulk substrate portion has a diode photodetector formed therein.
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