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Polishing pad surface shape measuring apparatus, the use of a polishing pad surface shape measuring apparatus, measuring method of the cone apex angle of the polishing pad, the groove depth measurement method for a polishing pad, CMP polishing apparatus, and a method of manufacturing a semiconductor device
Polishing pad surface shape measuring apparatus, the use of a polishing pad surface shape measuring apparatus, measuring method of the cone apex angle of the polishing pad, the groove depth measurement method for a polishing pad, CMP polishing apparatus, and a method of manufacturing a semiconductor device
Measure the distance Lm to the surface of the pads 2a, the main sensor 15 measures the distance Ls to the surface of the reference block 12 to the sub-sensor 16. What is measured value is actually a value (Lm + Ls). Reference block 12 is used to provide a reference position for measuring the surface position of the pads 2a, Thus, for example, the position of the movable element 9 is varied due to deformation of the guide 8 and the guide holding plate 7 , correct measurement is to be carried out. Pole screw 10 is rotated by rotating the motor 11, the movable element 9 is moved from side to side, to measure the distance to the pad 2a. From the measurement data of this distance, I ask cone apex angle of the pad 2a, depth, thickness and other.
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