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INTEGRATED CIRCUIT CHIP, INTEGRATED CIRCUIT CHIP MANUFACTURING METHOD, FLIP CHIP PACKAGE WITH THE INTEGRATED CIRCUIT CHIP AND FLIP CHIP PACKAGE MANUFACTURING METHOD
INTEGRATED CIRCUIT CHIP, INTEGRATED CIRCUIT CHIP MANUFACTURING METHOD, FLIP CHIP PACKAGE WITH THE INTEGRATED CIRCUIT CHIP AND FLIP CHIP PACKAGE MANUFACTURING METHOD
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机译：集成电路芯片，集成电路芯片制造方法，具有集成电路芯片的翻转芯片封装和翻转芯片封装制造方法
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摘要
PURPOSE: An integrated circuit chip, integrated circuit chip manufacturing method, flip chip package with the integrated circuit chip and flip chip package manufacturing method are provided to separate a second bump structure from the central line of a wiring line as much as a fixed distance, thereby preventing stress from being concentrated on the wiring line.;CONSTITUTION: An integrated circuit structure comprises a first area with a wiring line and a second area without a wiring line. The integrated circuit structure comprises a plurality of conductive structures and a wiring line(116). An electrode pad comprises a first electrode pad and a second electrode pad(114b). A passivation layer pattern comprises a first opening and a second opening and is arranged on the electrode pad. A bump structure comprises a first bump structure and a second bump structure(130).;COPYRIGHT KIPO 2011
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