SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDER BONDING METHOD

• 1. 焊点检测模型训练方法、焊点检测方法及焊点检测装置 [P] . 中国专利： CN113971654A . 2022-01-25
• 2. 一种焊点排布结构、焊点连接结构、耳机及电子产品 [P] . 中国专利： CN206164849U . 2017.05.10
• 3. SOLDERING STRUCTURE SUITABLE FOR SOLDERING ELECTRIC COMPONENT HAVING LOW HEAT RESISTANCE BY USING LEAD-FREE SOLDER AND METHOD FOR BONDING SOLDER AND ELECTRONIC PART [P] . 韩国专利： KR20040030353A . 2004-04-09

  机译： 适用于通过使用无铅焊料来焊接具有低耐热性的电气部件的焊接结构以及用于焊接焊料和电子部件的方法

• 4. SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDER JOINT METHOD [P] . 日本专利： JP2011009335A . 2011-01-13

  机译： 焊点连接结构，使用相同的电子设备和焊点连接方法

• 5. The solder are jointed the electronic circuit device and the solder connection method and the solder null for the gold-plating joint terminal [P] . 日本专利： JP3181283B2 . 2001-07-03

  机译： 焊料与电子电路装置，焊料的连接方法以及镀金接头端子的焊料无效连接

• 1. Accelerated Reliability Test Method of Thermal Cycle Life for Solder Joints of Electronic Devices [J] . Yasumi UEGAI, Shuichi TANI 材料 . 2004,第2期
• 2. Accelerated Reliability Test Method of Thermal Cycle Life for Solder Joints of Electronic Devices [J] . Yasumi UEGAI, Shuichi TANI 材料 . 2004,第2期
• 3. Measurement of the thermomechanical behaviour f the solder-lead interface in solder joints by laser probing: a new method for measuring the bond quality. [J] . S. Dilhaire, A. Cornet, E. Schaub Microelectronics & Reliability . 1998,第6a8期
• 4. Reliable evaluation method for solder joints in vehicle electronics devices considering the actual use conditions [C] . Okuyama Satoru, Yu Qiang, Akutsu Takahiro Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on . 2012
• 5. Quality inspection and reliability study of solder bumps in packaged electronic devices: Using laser ultrasound and finite element methods [D] . Yang, Jin 2008
• 6. Reliability issues of lead-free solder joints in electronic devices [O] . Nan Jiang, Liang Zhang, Zhi-Quan Liu, 2019
• 7. Reliability Design Method for Solder Joints Based on Coupled Thermal-Stress Analysis of Electronics Packaging Structure [O] . Kenji HIROHATA, Katsumi HISANO, Hiroyuki TAKAHASHI, 2006

• 1. Effect of Thermal Cycling on Properties and Microstructure of SnAgCuCe Soldered Joints in QFP Devices [J] . ZHANG Liang ,XUE Songbai ,GAO Lili . 中国机械工程学报 . 2011,第004期
• 2. Effect of Thermal Cycling on Properties and Microstructure of SnAgCuCe Soldered Joints in QFP Devices [J] . ZHANG Liang ,XUE Songbai ,GAO Lili . 中国机械工程学报 . 2011,第004期
• 3. Reliability Evaluation of QFN Devices Soldered Joints with Creep Model [J] . JI Feng ,XUE Songbai ,ZHANG Liang . 中国机械工程学报 . 2011,第003期
• 4. Reliability Evaluation of QFN Devices Soldered Joints with Creep Model [J] . JI Feng ,XUE Songbai ,ZHANG Liang . 中国机械工程学报 . 2011,第003期
• 5. MECHANICAL PROPERTIES OF FINE PITCH DEVICES SOLDERED JOINTS BASED ON CREEP MODEL [J] . . 中国机械工程学报 . 2008,第006期
• 6. 某车型后搁板与后地板连接结构焊点失效研究与改进 [C] . Zou Suping ,邹素平 ,Wei Yugong . 2015中国汽车工程学会年会 . 2015
• 7. 低银复合焊料合金和焊点微观结构及其力学性能研究 [A] . 李振豪 . 2020