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LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS

机译：无铅焊料合金，包含焊料合金的耐疲劳焊料和使用该焊料的接合产品

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摘要

[PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using the soldering material.;[MEANS FOR SOLVING] 0.1 to 1.5% by weight of Cu, 0.01% by weight or more and less than 0.05% by weight of Co, 0.05 to 0.25% by weight of Ag, 0.001 to 0.008% by weight of Ge, and the remainder being Sn. This low silver lead-free solder alloy is blended with a pasty flux or molded in a liner form by using a solid or pasty flux as a core.;[SELECTED FIGURE] FIG. 2

机译：[要解决的问题]为了提供润湿性优异且耐热疲劳性优异的低银无铅焊料合金，以及耐疲劳性优异的焊锡膏焊料和树脂通量芯焊料， [用于解决的手段] Cu的0.1至1.5重量％，Co的0.01重量％以上且小于0.05重量％，Ag的0.05至0.25重量％， Ge为0.001〜0.008重量％，其余为Sn。将这种低银无铅焊料合金与糊状助焊剂混合或通过使用固体或糊状助焊剂作为芯以衬里形式模制。 2 展开▼

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公开/公告号US2011274937A1

专利类型

公开/公告日2011-11-10

原文格式PDF

申请/专利权人 KENICHIRO SUGIMORI;SEIJI YAMADA;SATOSHI KAWAKUBO;ATSUSHI IRISAWA;
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申请/专利号US201013145163

发明设计人 KENICHIRO SUGIMORI;SEIJI YAMADA;SATOSHI KAWAKUBO;ATSUSHI IRISAWA;
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申请日2010-01-18

分类号B32B15/04;B23K35/34;C22C13;

国家 US

入库时间 2022-08-21 18:14:59

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2. 无铅焊料合金和含有该焊料合金的耐疲劳性焊料接合材料以及使用该接合材料的接合体 [P] . 中国专利： CN102006967A . 2011-04-06

3. LEAD-FREE SOLDER ALLOY, FATIGUE-RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS [P] . IN2011MN01556A . 2012-01-13

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4. LEAD-FREE SOLDER ALLOY, FATIGUE-RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS [P] . 世界知识产权组织专利： WO2010087241A1 . 2010-08-05

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5. 低银多元合金无铅焊料——无铅焊料发展动态与趋势 [C] . 吴念祖 ,吴坚 . 2013中国高端SMT学术会议 . 2013

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