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TWO-LAYER FLEXIBLE BOARD, METHOD OF MANUFACTURING THE SAME, TWO-LAYER FLEXIBLE WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND PLASMA PROCESSING DEVICE
TWO-LAYER FLEXIBLE BOARD, METHOD OF MANUFACTURING THE SAME, TWO-LAYER FLEXIBLE WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND PLASMA PROCESSING DEVICE
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机译：两层挠性板，其制造方法，两层挠性布线板，其制造方法和等离子体处理装置
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摘要
PROBLEM TO BE SOLVED: To provide a two-layer flexible board formed by making, equal to or larger than that of a conventional three-layer flexible board, adhesiveness related to reliability in a heat-resistance environment or a high-temperature and high-humidity environment that is an issue of a two-layer flexible board having an advantage allowing the thickness of the board itself to be reduced.;SOLUTION: This two-layer flexible board is formed by forming a base metal layer at least on one surface of an insulator film without interposing an adhesive, and then forming a copper coating layer on the base metal layer. In the two-layer flexible board, a reforming layer having a layer thickness of 2-10 nm is formed on a surface of the insulator film on the side in contact with the base metal layer.;COPYRIGHT: (C)2011,JPO&INPIT
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