首页> 外国专利> METHOD OF MANUFACTURING TUNING FORK TYPE CRYSTAL VIBRATION CHIP, CRYSTAL DEVICE

METHOD OF MANUFACTURING TUNING FORK TYPE CRYSTAL VIBRATION CHIP, CRYSTAL DEVICE

机译:音叉式晶体振动片,晶体器件的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a tuning fork type crystal vibration chip wherein an angle from the front and rear surfaces of an oscillation arm to the fork or the end face of a groove on the base side is gentle.;SOLUTION: The method of manufacturing a tuning fork type crystal vibration chip (10A) includes a photolithography step for exposing the areas corresponding to the base (11), the oscillation arm (12A), and the groove (13A) by coating an anticorrosion film deposited on a crystal material with resist and then exposing the resist, a first etching step for forming the outline of the tuning fork type crystal vibration chip by etching the anticorrosion film excepting the areas corresponding to the base, the oscillation arm, and the groove, and also etching the crystal material, a removing step for removing the anticorrosion film and the resist remaining on the crystal material, and a second etching step for etching either the first fork (14A) formed between a pair of oscillation arms and the base or the end face of a groove on the base side by immersing the crystal material in the etching agent after the removing step.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种制造音叉型晶体振动片的方法,其中,从振动臂的前,后表面到基部侧的叉或凹槽的端面的角度平缓。 :音叉型晶体振动芯片(10A)的制造方法包括光刻步骤,该光刻步骤通过涂覆沉积的防腐蚀膜来暴露与基底(11),振荡臂(12A)和凹槽(13A)相对应的区域。在具有抗蚀剂的晶体材料上然后曝光该抗蚀剂,第一蚀刻步骤是通过蚀刻除对应于基部,振动臂和凹槽的区域之外的防腐蚀膜来形成音叉型晶体振动芯片的轮廓,以及还蚀刻晶体材料,除去步骤以除去防腐膜和残留在晶体材料上的抗蚀剂,以及第二蚀刻步骤,以蚀刻形成于两者之间的第一叉子(14A)在去除步骤后,通过将晶体材料浸入蚀刻剂中,在一对振动臂和基座或基座侧面上的凹槽端面上制造。;版权所有:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP2011211452A

    专利类型

  • 公开/公告日2011-10-20

    原文格式PDF

  • 申请/专利权人 NIPPON DEMPA KOGYO CO LTD;

    申请/专利号JP20100076503

  • 发明设计人 AMANO YOSHIAKI;

    申请日2010-03-30

  • 分类号H03H3/02;H03H9/19;H03H9/215;H01L41/09;H01L41/18;H01L41/22;

  • 国家 JP

  • 入库时间 2022-08-21 18:25:46

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