首页> 外国专利> Method for fixing through hole technology component on side of printed circuit board, involves applying molded part made from hot glue on adhesive area provided on printed circuit board for fixing through hole technology components

Method for fixing through hole technology component on side of printed circuit board, involves applying molded part made from hot glue on adhesive area provided on printed circuit board for fixing through hole technology components

机译：将通孔技术部件固定在印刷电路板侧面上的方法，包括将由热胶制成的模制件涂覆在印刷电路板上提供的用于将通孔技术部件固定的粘合区域上。

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摘要

The method involves applying a molded part (5) made from a hot glue on an adhesive area provided on a printed circuit board (1) for fixing through hole technology (THT) components (3). The printed circuit board is mounted with the THT components. The THT components are fixed on the printed circuit board by bonding, where the printed circuit board is heated to a softening temperature of the hot glue. An independent claim is also included for a method for manufacturing a printed circuit board.

机译：该方法包括将由热胶制成的模制部件（5）施加到设置在印刷电路板（1）上的粘合区域上，以固定通孔技术（THT）组件（3）。印刷电路板上装有THT组件。 THT组件通过粘接固定在印刷电路板上，在此将印刷电路板加热到热胶的软化温度。还包括用于制造印刷电路板的方法的独立权利要求。

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公开/公告号DE102009002288A1

专利类型
公开/公告日2010-10-14

原文格式PDF
申请/专利权人 ENDRESS + HAUSER GMBH + CO. KG;
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申请/专利号DE20091002288
发明设计人 GLATZ FRANZ;BUSCHKE INGO;BIRGEL DIETMAR;
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申请日2009-04-08
分类号H05K3/30;
国家 DE
入库时间 2022-08-21 18:28:29

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