首页> 外国专利> RACK FOR PRINTED CIRCUIT BOARD ELECTROLESS PLATING WHICH REDUCE PLATING COSTS BY PERFORMING ELECTROLESS PLATING A PCB REGARDLESS OF THE THICKNESS OF A RACK

RACK FOR PRINTED CIRCUIT BOARD ELECTROLESS PLATING WHICH REDUCE PLATING COSTS BY PERFORMING ELECTROLESS PLATING A PCB REGARDLESS OF THE THICKNESS OF A RACK

机译:通过执行不考虑机架厚度的PCB的无电电镀来减少印刷成本的印刷电路板无电电镀的机架

摘要

PURPOSE: A rack for printed circuit board electroless plating is provided to make plating failure modulus zero by fixing a PCB on the rack.;CONSTITUTION: A rack for printed circuit board electroless plating comprises a lower portion fixing rack, a side portion fixing rack(112) and a horizontal movement rack(113). The lower portion fixing rack is fixed and arranged to the bottom of a PCB rack at a preset regular interval. The side portion fixing rack is fixed to side both side of the PCB rack. The horizontal movement rack is inserted into the horizontal support bar installed in the back side of the PCB rack in the horizontal direction. The horizontal movement rack fixes PCB in the horizontal direction. A vertical movement rack(114) is included and fixes the PCB in the vertical direction.;COPYRIGHT KIPO 2010
机译:用途:提供用于印刷电路板化学镀的机架,以通过将PCB固定在机架上来使电镀失效模量为零。;组成:用于印刷电路板化学镀的机架包括下部固定机架,侧部固定机架112)和水平移动架(113)。下部固定架以预定的规则间隔固定并布置在PCB架的底部。侧部固定架被固定到PCB架的两侧。将水平移动机架插入水平安装在PCB机架背面的水平支撑杆中。水平移动架将PCB沿水平方向固定。包括一个垂直移动架(114),并在垂直方向上固定PCB。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100026794A

    专利类型

  • 公开/公告日2010-03-10

    原文格式PDF

  • 申请/专利权人 HYUN JIN ELECTRONICS CO. LTD.;

    申请/专利号KR20080085938

  • 发明设计人 CHOI SOO WOONG;TAE BONG JIN;

    申请日2008-09-01

  • 分类号C25D17/06;H05K3/18;

  • 国家 KR

  • 入库时间 2022-08-21 18:33:09

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号