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ELECTROLESS PLATING APPARATUS WHICH FORMS A PLATING LAYER WITH A UNIFORM THICKNESS ON THE FRONT SURFACE OF A PRINTED CIRCUIT BOARD BY INDIVIDUALLY FLOWING PLATING LIQUID FROM THE TOP PART TO THE BOTTOM PART OF A VERTICALLY FIXED PRINTED CIRCUIT BOARD WITH A SPRAY UNIT
ELECTROLESS PLATING APPARATUS WHICH FORMS A PLATING LAYER WITH A UNIFORM THICKNESS ON THE FRONT SURFACE OF A PRINTED CIRCUIT BOARD BY INDIVIDUALLY FLOWING PLATING LIQUID FROM THE TOP PART TO THE BOTTOM PART OF A VERTICALLY FIXED PRINTED CIRCUIT BOARD WITH A SPRAY UNIT
PURPOSE: An electroless plating apparatus is provided to prevent neighboring printed circuit boards from contacted or separated by being respectively horizontally moved by a transferring unit.;CONSTITUTION: An electroless plating apparatus(100) comprises a plating bath(110) wherein plating liquid is stored, a transferring unit(120) which horizontally transfers a plurality of printed circuit boards(130) fixed in a lower part, a spray unit(140) which is combined with the transferring unit and sprays the plating liquid to the front side of the printed circuit board, and a circulation part(150) wherein one end of the circulation part is communicated with a supply line connected to the spray unit and the other end part of the circulation part forms a circulating pump in which a suction line connected to the plating bath.;COPYRIGHT KIPO 2010
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