首页> 外国专利> AlGaN/GaN HEMTs having a gate contact on a GaN based cap segment and methods of fabricating same

AlGaN/GaN HEMTs having a gate contact on a GaN based cap segment and methods of fabricating same

机译:在基于GaN的帽段上具有栅极触点的AlGaN / GaN HEMT及其制造方法

摘要

There is provided a high electron mobility transistor (HEMT) and the production method. Devices in accordance with embodiments of the invention include an aluminum gallium nitride (AlGaN) barrier layer on the gallium nitride (GaN) channel layer and the channel layer. Is provided with a first ohmic contact on the barrier layer 16 is formed a source electrode 18, a second ohmic contact is also provided to be spaced apart from the source electrode 18 is formed with a drain electrode 20. A GaN based cap segment (30) is provided on the barrier layer 16 between the source electrode 18 and drain electrode 20. GaN based cap segment 30 may have a spaced apart from the source electrode 18 has a first side wall adjacent to (31) are spaced apart from the drain electrode 20 adjacent to the second side wall (32). On the GaN based cap segment 30, a non-ohmic contact is provided to form a gate contact (22). Gate contact (22) has a first side wall 31 and substantially the first side wall (27) aligned in a GaN based cap segment 30. Gate contact 22 is only part of the height distance between the first side wall 31 and the second side wall 32 of the GaN-based cap segment 30.
机译:提供了一种高电子迁移率晶体管(HEMT)及其制造方法。根据本发明的实施例的器件包括在氮化镓(GaN)沟道层和沟道层上的氮化铝镓(AlGaN)阻挡层。在势垒层16上设有第一欧姆接触,形成有源电极18,与源电极18间隔开的第二欧姆接触,还具有有漏电极20。GaN基帽段(30在源电极18与漏电极20之间的势垒层16上设置有如图3所示的)。在图20中与第二侧壁(32)相邻。在GaN基盖段30上,提供非欧姆接触以形成栅极接触(22)。栅极接触件(22)具有第一侧壁31和基本上第一侧壁(27),其对准在基于GaN的帽段30中。栅极接触件22仅是第一侧壁31和第二侧壁之间的高度距离的一部分。 GaN基盖段30的32。

著录项

  • 公开/公告号KR100933277B1

    专利类型

  • 公开/公告日2009-12-22

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20047000318

  • 发明设计人 스미쓰리차드피터;

    申请日2002-03-26

  • 分类号H01L29/778;

  • 国家 KR

  • 入库时间 2022-08-21 18:33:39

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