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SOLUTION FOR ETCHING A METALLIC LAYER WITH IMPROVED RATE OF AN ETCHING PROCESS AND SURFACE PROPERTY OF THE ETCHED METAL LAYER, AND A METHOD FOR ETCHING A METALLIC LAYER USING THE SAME
SOLUTION FOR ETCHING A METALLIC LAYER WITH IMPROVED RATE OF AN ETCHING PROCESS AND SURFACE PROPERTY OF THE ETCHED METAL LAYER, AND A METHOD FOR ETCHING A METALLIC LAYER USING THE SAME
PURPOSE: A solution for etching a metallic layer is provided to ensure excellent surface and high-speed etching rate of edge profiles, to ensure enough etching effect, to control reaction heat of a process, and to increase productivity.;CONSTITUTION: A solution for etching a metallic layer comprises ferric chloride(FeCl3), cupric chloride(CuCl2), a first acid containing chlorine ions, a second acid with viscosity higher than the first acid, and a hydrophilic solvent. The second acid has a viscosity of 20 cP or more, and is phosphoric acid or sulfuric acid. The hydrophilic solvent is one selected from the group consisting of water, ethanol, methanol and their mixture. The first acid is the acid mixed with neutral chloride or hydrochloric acid.;COPYRIGHT KIPO 2010
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