首页> 外国专利> LIGHT EMITTING DIODE METAL HOUSING OF A PRESS FORGE METHOD AND A LIGHT EMITTING DIODE METAL PACKAGE USING THE SAME, CAPABLE OF IMPROVING THE BRIGHTNESS OF AN OPTICAL DEVICE PACKAGE BY INCREASING ILLUMINANCE OF A REFLECTIVE SURFACE

LIGHT EMITTING DIODE METAL HOUSING OF A PRESS FORGE METHOD AND A LIGHT EMITTING DIODE METAL PACKAGE USING THE SAME, CAPABLE OF IMPROVING THE BRIGHTNESS OF AN OPTICAL DEVICE PACKAGE BY INCREASING ILLUMINANCE OF A REFLECTIVE SURFACE

机译:压锻法的发光二极管金属外壳和使用相同的发光二极管金属封装,能够通过增加反射面的照度来提高光学装置封装的亮度

摘要

PURPOSE: A light emitting diode metal housing of a press forge method and a light emitting diode metal package using the same are provided to standardize the volume of an LED housing uniformly by forming a housing body and a reflective protrusion mounted on an LED chip made of the metal.;CONSTITUTION: An LED chip(2) is mounted in a housing body(10). A chip mounting unit and a reflector are made of the metal material in an LED housing. One or more LED chips are mounted on the center of a reflective protrusion(20) on an upper side of the LED housing. An external terminal(15-1,15-2) connected to the LED chip is protruded to both sides of the LED housing. A casting material(25) is filled in an inner side of the reflective protrusion.;COPYRIGHT KIPO 2010
机译:目的:提供压锻法的发光二极管金属壳体和使用该壳体的发光二极管金属封装,以通过形成壳体和安装在由其制成的LED芯片上的反射突起来均匀地标准化LED壳体的体积。组成:LED芯片(2)安装在壳体(10)中。芯片安装单元和反射器由LED外壳中的金属材料制成。一个或多个LED芯片被安装在LED壳体的上侧上的反射突起(20)的中心上。连接到LED芯片的外部端子(15-1,15-2)突出到LED外壳的两侧。反射突起的内侧填充有铸造材料(25)。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20090115992A

    专利类型

  • 公开/公告日2009-11-11

    原文格式PDF

  • 申请/专利权人 YOON SUNG NO;KIM MIN KONG;

    申请/专利号KR20080041641

  • 发明设计人 YOON SUNG NO;KIM MIN KONG;

    申请日2008-05-06

  • 分类号H01L33/00;

  • 国家 KR

  • 入库时间 2022-08-21 18:34:05

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