首页> 外国专利> Wire-written circuit board or board with etched circuit routes and contact pads and method for manufacturing a wire-written circuit board or board with etched contact pads.

Wire-written circuit board or board with etched circuit routes and contact pads and method for manufacturing a wire-written circuit board or board with etched contact pads.

机译:具有蚀刻的电路路径和接触垫的线写电路板或电路板以及具有蚀刻的接触垫的线写电路板或电路板的制造方法。

摘要

The circuit board has conductor wires (6) extending between connection points (4) on or in the circuit board. At least some of the conductor wires have a square or rectangular cross-section. The side of the rectangular conductor wires with the largest dimension faces the circuit board. At least some of the conductor wires may have a hollow section filled with cooling fluid.
机译:电路板具有在电路板上或电路板上的连接点(4)之间延伸的导线(6)。至少一些导线具有正方形或矩形的横截面。矩形导线的最大尺寸的一面朝向电路板。至少一些导线可具有填充有冷却流体的中空部分。

著录项

  • 公开/公告号EP2076100B1

    专利类型

  • 公开/公告日2010-11-10

    原文格式PDF

  • 申请/专利权人 JUMATECH GMBH;

    申请/专利号EP20090003831

  • 发明设计人 WOELFEL MARKUS;

    申请日2006-01-24

  • 分类号H05K1/02;H05K3/10;H05K3/22;

  • 国家 EP

  • 入库时间 2022-08-21 18:37:42

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