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Test structure for estimating electromigration effects with increased robustness with respect to barrier defects in vias

机译:用于评估通孔中的势垒缺陷具有更高鲁棒性的电迁移效应的测试结构

摘要

By providing vias of increased mass flow blocking capability next to respective line segments of an electromigration test structure, the reliability of respective assessments may be enhanced, since electromigration-induced void formation in the test line segment under consideration may be efficiently decoupled from metal diffusion of neighboring test areas of the test structure.
机译:通过在电迁移测试结构的各个线段旁边提供增加质量流量阻挡能力的通孔,可以增强各个评估的可靠性,因为可以有效地将考虑中的测试线段中电迁移引起的空隙形成与金属扩散扩散分离。测试结构的相邻测试区域。

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