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Alignment accuracy determining method for use during connection of microelectromechanical system wafers, involves deriving alignment accuracy from measured electrical characteristics of lower contact-structure and upper contact structure
Alignment accuracy determining method for use during connection of microelectromechanical system wafers, involves deriving alignment accuracy from measured electrical characteristics of lower contact-structure and upper contact structure
The method involves designing a lower contact-structure (10) such that the contact structure exhibits two different relative positions and an upper contact structure (9) of different electrical characteristics. The characteristics are measurable at a lower wafer (1) and upper wafer (2) i.e. covering wafer, via one of connection pads (12) after connection of wafers. The electrical characteristics of the lower contact structure are measured via the pads after the connection, and alignment accuracy is derived from the measured electrical characteristics of the lower and upper structures.
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