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Method for preparing Single-Electron Logic Transistor with Dual Gates operating at Room Temperature

机译:在室温下工作的双栅极单电子逻辑晶体管的制备方法

摘要

present invention is negative-positive photoresist and the photoresist pattern width of the nanowire over a defined area and nanowires dual operating at room temperature to form the two gates can control the potential of the quantum dot to the right and left sides of the nanowire region through the selection ratio of the etching caused by the height difference of negative photoresist and the nanowire region other than the gate region is present on the single-electron logic device It relates to a process for the production of. In order to achieve this, (a) etching the semiconductor layer of a substrate having an insulating layer between the semiconductor layer and defining a channel region; (B) forming an oxide film on the channel region; (C) forming a negative photoresist pattern on the oxide film; (D) forming a positive photoresist pattern on a vertical sound photosensitive film pattern; (E) forming a nanowire region by etching the oxide layer and the semiconductor layer exposed by the positive photoresist pattern; (F) forming a quantum dot to form an oxide film on both sides of the silicon layer; (G) forming a gate on top of the negative photosensitive film pattern; (H) a step of coating a positive photosensitive film on the top side rotates in the whole of the semiconductor layer; (I) etching the photoresist from the top of the thin thickness speech by removing the two gates to the left and right around the negative photosensitive film pattern; And, (j) depositing an oxide film and a step of forming a gate metal over all of the negative photosensitive area.
机译:本发明是负阳性光致抗蚀剂,并且纳米线的光致抗蚀剂图案宽度在限定的区域上以及在室温下双重操作以形成两个栅极的纳米线可以控制穿过纳米线区域的右侧和左侧的量子点的电势。由负性光刻胶和除栅极区域以外的纳米线区域的高度差引起的蚀刻的选择率存在于单电子逻辑器件上。为了实现这一点,(a)蚀刻在半导体层之间具有绝缘层并限定沟道区的衬底的半导体层; (B)在沟道区上形成氧化膜; (C)在氧化膜上形成负性光刻胶图形; (D)在垂直声光敏膜图形上形成正性光刻胶图形; (E)通过蚀刻通过正性光刻胶图案暴露的氧化物层和半导体层来形成纳米线区域; (F)在硅层的两面上形成量子点以形成氧化膜; (G)在负型感光膜图案的顶部形成栅极; (H)在整个半导体层中旋转在顶面上涂覆正光敏膜的步骤。 (I)通过去除负感光膜图案周围的左右两个栅极,从薄壁语音的顶部蚀刻光致抗蚀剂;并且,(j)沉积氧化膜和在所有负光敏区域上形成栅极金属的步骤。

著录项

  • 公开/公告号KR100905869B1

    专利类型

  • 公开/公告日2009-07-03

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20060098330

  • 发明设计人 최중범;최성진;김상진;이창근;

    申请日2006-10-10

  • 分类号H01L21/336;

  • 国家 KR

  • 入库时间 2022-08-21 19:11:50

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