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METHOD FOR MANUFACTURING AN INSULATING SHEET AND A METHOD FOR MANUFACTURING A LAMINATED PLATE CLAD WITH A METAL FOIL AND A PRINTED CIRCUIT BOARD THEREOF USING THE SAME, CAPABLE OF MANUFACTURING THE INSULATION SUBSTRATE CLOSE TO A COEFFICIENT OF THERMAL EXPANSION OF A SEMICONDUCTOR CHIP
METHOD FOR MANUFACTURING AN INSULATING SHEET AND A METHOD FOR MANUFACTURING A LAMINATED PLATE CLAD WITH A METAL FOIL AND A PRINTED CIRCUIT BOARD THEREOF USING THE SAME, CAPABLE OF MANUFACTURING THE INSULATION SUBSTRATE CLOSE TO A COEFFICIENT OF THERMAL EXPANSION OF A SEMICONDUCTOR CHIP
PURPOSE: A method for manufacturing an insulating sheet and a method for manufacturing a laminated plate clad with a metal foil and a printed circuit board thereof using the same are provided to prevent a clack or exfoliation of connection member such as a lead free solder since stress between the semiconductor chip and adhesive member of the printed circuit board.;CONSTITUTION: A method for manufacturing an insulating sheet is comprised of the steps: a thermoplastic resin layer(20) is laminated on a reinforcing substrate(10); and the thermoplastic resin layer is thermal pressured on the reinforcing substrate. A method of manufacturing a metal layer laminated layer is comprised of the steps: a thermoplastic resin layer is laminated on the reinforcing substrate; thermoplastic fiber layer is thermal- pressured to the reinforcing substrate; a metal layer(30) is formed in the thermoplastic resin layer.;COPYRIGHT KIPO 2010
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