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Substrate Including Barrier Solder Bumps to Control Underfill Transgression and Microelectronic Package including Same
Substrate Including Barrier Solder Bumps to Control Underfill Transgression and Microelectronic Package including Same
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机译：包括用于控制底部填充侵害的势垒焊料凸块的基板以及包括该基板的微电子封装
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摘要
A microelectronic substrate and a microelectronic package including the substrate and a die bonded thereto. The substrate includes a substrate panel having a die-side surface including a die-attach region; a system of interconnects extending through the substrate panel and adapted to allow a connection of the substrate to external circuitry; and a plurality of solder bumps including: die-attach solder bumps electrically coupled to the system of interconnects and disposed in the die-attach region; and barrier solder bumps isolated from the system of interconnects, the barrier solder bumps being disposed outside of the die-attach region and being adapted to substantially limit a flow of underfill away from the die-attach region.
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