首页> 外国专利> The IGBT self clamp induction switch (SCIS) energy density and device production readiness were improved thick buffer field design

The IGBT self clamp induction switch (SCIS) energy density and device production readiness were improved thick buffer field design

机译:改进了IGBT自钳感应开关(SCIS)的能量密度和器件生产就绪性,并改进了厚缓冲场设计

摘要

IGBT increased doping to possess the thick buffer territory, depending, you improve the self clamp induction switch and device production. Planer or trench gate IGBT has had the buffer layer which is thicker than 25 microns. Because buffer layer has doped sufficiently, as for that carrier it is more in comparison with the minority carrier in the transition section with the especially N buffer and the N drift territory.
机译:IGBT增加了掺杂以拥有较厚的缓冲区域,从而改善了自钳感应开关和器件的生产。平面或沟槽栅极IGBT的缓冲层厚度大于25微米。因为缓冲层已经足够地掺杂,所以对于该载流子,与具有N个缓冲和N个漂移区的过渡区中的少数载流子相比要更多。

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