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Semiconductor component producing method, involves applying wiring structure with conductive strips and contact connection surfaces on upper side of carrier wafer, and applying semiconductor chips on upper side of carrier wafer
Semiconductor component producing method, involves applying wiring structure with conductive strips and contact connection surfaces on upper side of carrier wafer, and applying semiconductor chips on upper side of carrier wafer
The method involves providing a carrier wafer (1) on a semiconductor material with an upper side (4) and a lower side (3). A wiring structure (5) is applied with conductive strips and contact connection surfaces on the upper side of the carrier wafer. Semiconductor chips (6) and plastic housing measures are applied on the upper side of the carrier wafer. The semiconductor chips are embedded into the plastic housing measures, where a composite board (16) is formed from semiconductor chips and plastic housing measures. An independent claim is also included for a compound body with a carrier wafer and a composite board with semiconductor chips embedded in the plastic housing measures.
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