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DIELECTRIC COMPOSITIONS FOR Y5V TYPE MULTILAYER CERAMIC CHIP CAPACITORS, AND MANUFACTURING METHOD THEREOF
DIELECTRIC COMPOSITIONS FOR Y5V TYPE MULTILAYER CERAMIC CHIP CAPACITORS, AND MANUFACTURING METHOD THEREOF
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机译：Y5V型多层陶瓷芯片电容器的介电组成及其制造方法
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摘要
A dielectric composition is provided to prevent crack which often occurs in chips produced from the conventional Y5V dielectric ceramic composition, and to improve IR falling. A dielectric composition for Y5V type multi-layer ceramic chip capacitors is obtained by adding predetermined amounts of at least two selected from Mn_(1+delta)TiO_3(0delta=0.05), BiVO4, and B-silicate glass frit to a composition of (Ba_(1-x)Ca_x)_m(Ti_(1-y)Zr_y)O_3+zY_2O_3(wherein, 0.01=x=0.08, 0.17=y=0.24, 0.001=z=0.004, and 1=m=1.04). A method for preparing the dielectric composition includes the steps of: mixing raw materials comprising BaCO3, CaCO3, TiO2, and ZrO2, and calcining the mixture; mixing the powder obtained by the calcination with Mn_(1+delta)TiO_3, BiVO4, B-silicate glass frit, and Y2O3, milling and drying the mixture; and adding a small amount of a binder to the dry powder, molding the admixture into a predetermined form, sintering and re-oxidizing the molded material.
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