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MONITORING METHOD OF PLASMA PROCESSES USING WAVELET TRANSFORMATION OF THIN FILM SURFACE CHARACTERISTIC PATTERNS
MONITORING METHOD OF PLASMA PROCESSES USING WAVELET TRANSFORMATION OF THIN FILM SURFACE CHARACTERISTIC PATTERNS
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机译：薄膜表面特征图案小波变换的等离子体过程监测方法
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摘要
A method for monitoring a plasma process using a wavelet transformation of a thin-film surface characteristic pattern is provided to improve a progress monitoring effect by using an atomic force microscopy and a discrete wavelet transformation. A plasma process monitoring method is comprised of an AFM(Atomic Force Microscopy) image collection, a wavelet converter(11) of an AFM image for the collected image, and a monitoring metric(12) for monitoring plasma. A surface roughness image is collected using an AFM. A gray code in a scanned image is converted into a bit map and then a DC(Direct Current) component is eliminated. A discrete wavelet transformation is applied to the resultant image to obtain an approximate portion of the scanned image. Histogram is applied to the approximate portion to extract a surface roughness contour. The discrete wavelet transformation is applied to the extracted surface roughness contour to obtain data with respect to a fine component. A pattern for a value consisting the data with respect to the fine component monitors the plasma.
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