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AN INTEGRATED CIRCUIT PACKAGE, AND A METHOD FOR PRODUCING AN INTEGRATED CIRCUIT PACKAGE HAVING TWO DIES WITH INPUT AND OUTPUT TERMINALS OF INTEGRATED CIRCUITS OF THE DIES DIRECTLY ADDRESSABLE FOR TESTING OF THE PACKAGE
AN INTEGRATED CIRCUIT PACKAGE, AND A METHOD FOR PRODUCING AN INTEGRATED CIRCUIT PACKAGE HAVING TWO DIES WITH INPUT AND OUTPUT TERMINALS OF INTEGRATED CIRCUITS OF THE DIES DIRECTLY ADDRESSABLE FOR TESTING OF THE PACKAGE
An integrated circuit package (1) comprising first and second dies on a laminate (5) in a resin encapsulating housing (6) comprises a digital signal processing integrated circuit (8) fabricated on the first die (2), and a digital-to-analogue converting circuit (9) fabricated on the second die (3). First external terminals (16) are selectively coupled to corresponding first input terminals (10) of the digital signal processing circuit (8) through corresponding primary input switches (19), and first output terminals (11) of the digital signal processing circuit (8) are selectively coupled through primary output switches (23) and secondary input switches (25) to second input terminals (12) of the digital-to-analogue converting circuit (9). Second output terminals (13) of the digital-to-analogue converting circuit (9) are selectively coupled to second external terminals (17) through secondary output switches (30). The switches (19,23,25,30) are configurable for selectively testing functions of the digital signal processing circuit (8) and the digital-to-analogue converting circuit (9) between selectable combinations of first input and output terminals (10,11) and second input and output terminals (12,13) by applying a test signal to an appropriate one of the first external terminals (16), and reading a response signal on an appropriate second external terminal (17).
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