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首页> 外国专利> ELECTROLYTIC COPPER FOIL AND PROCESS FOR PRODUCING ELECTROLYTIC COPPER FOIL, SURFACE TREATED ELCTROLYTIC COPPER FOIL USING SAID ELECTROLYTIC COPPER FOIL, AND COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD USING SAID SURFACE TREATED ELECTROLYTIC COPPER FOIL

ELECTROLYTIC COPPER FOIL AND PROCESS FOR PRODUCING ELECTROLYTIC COPPER FOIL, SURFACE TREATED ELCTROLYTIC COPPER FOIL USING SAID ELECTROLYTIC COPPER FOIL, AND COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD USING SAID SURFACE TREATED ELECTROLYTIC COPPER FOIL

机译：电解铜箔及其生产工艺，电解铜箔表面处理过的电解铜箔，覆铜箔层压板，以及用硬质表面处理过的铜版图印刷电路板

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摘要

It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super lowprofile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.
机译：本发明的一个目的是提供一种电沉积铜箔，其具有比市场上常规提供的低轮廓电沉积铜箔更低的轮廓和更高的光泽度。为了实现该目的，本发明使用具有超低轮廓，沉积侧的表面粗糙度（Rzjis）低于1.0微米，并且其光泽度[Gs（60度）]的电沉积铜箔。厚度不小于400。本发明还提供一种电沉积铜箔的制造方法，该电沉积铜箔是通过使用硫酸基铜电解溶液进行电沉积而获得的，所述硫酸基铜电解溶液通过添加3-巯基-1-丙烷磺酸和/或双（3-磺丙基丙基）二硫化物，季铵盐而获得。具有环状结构的聚合物和氯。

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