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ELECTROLYTIC COPPER FOIL AND PROCESS FOR PRODUCING ELECTROLYTIC COPPER FOIL, SURFACE TREATED ELECTROLYTIC COPPER FOIL USING SAID ELECTROLYTIC COPPER FOIL, AND COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD USING SAID SURFACE TREATED ELECTROLYTIC COPPER FOIL
ELECTROLYTIC COPPER FOIL AND PROCESS FOR PRODUCING ELECTROLYTIC COPPER FOIL, SURFACE TREATED ELECTROLYTIC COPPER FOIL USING SAID ELECTROLYTIC COPPER FOIL, AND COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD USING SAID SURFACE TREATED ELECTROLYTIC COPPER FOIL
This invention provides an electrolytic copper foil, which, as compared with low-profile electrolytic copper foils which have been supplied into the market, has lower profile and is glossy. The electrolytic copper foil has an ultralow profile of less than 1.0 Vm in terms of surface roughness (Rzjis) on the deposition face side independently of the thickness of the electrolytic copper foil, and, at the same time, the gloss [Gs(60°)] of the deposition face is not less than 400. This electrolytic copper foil can be produced, for example, by electrolysis using a sulfuric acid-type copper electrolysis solution prepared by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.
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