ELECTRICAL HOOK-UP PROCESS FOR IGBT TRANSISTOR CHIPS MOUNTED ON AN INTEGRATED CIRCUIT BOARD

• 1. 芯片直接贴装在电路板上的锂电池保护电路板的组装方法 [P] . 中国专利： CN101651237A . 2010-02-17
• 2. 作为倒装芯片安装在电路板上的温度传感器 [P] . 中国专利： CN102809441B . 2015.11.25
• 3. ELECTRICAL HOOK-UP PROCESS FOR IGBT TRANSISTOR CHIPS MOUNTED ON AN INTEGRATED CIRCUIT BOARD [P] . CA2286433A1 . 2000-04-30

  机译： 安装在集成电路板上的IGBT晶体管芯片的电气连接过程

• 4. METHOD FOR THE ELECTRICAL CONNECTION OF IGBT TRANSISTOR CHIPS MOUNTED ON A BOARD OF INTEGRATED CIRCUITS [P] . 法国专利： FR2785447A1 . 2000-05-05

  机译： 集成在电路板上的IGBT晶体管芯片的电连接方法

• 5. Method of electrically connecting IGBT transistor chips mounted on an integrated-circuit wafer [P] . 美国专利： US6297079B1 . 2001-10-02

  机译： 电连接安装在集成电路晶片上的IGBT晶体管芯片的方法

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