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Semiconductor memory device including post package repair control circuit and post package repair method

机译:半导体存储器件,包括后封装修复控制电路和后封装修复方法

摘要

Provided are a semiconductor memory device having a post package repair control circuit and a post package repair method. In the semiconductor memory device and the post package repair method, in a post package repair mode, a second memory bank is used as a fail bit map memory for storing failed bit information regarding a first memory bank, and the first memory bank is used as a fail bit map memory for storing failed bit information regarding the second memory bank.
机译:提供一种具有后封装修复控制电路和后封装修复方法的半导体存储装置。在半导体存储器件和封装后修复方法中,在封装后修复模式中,第二存储体被用作故障位图存储器,用于存储关于第一存储体的故障位信息,并且第一存储体被用作存储单元。故障位图存储器,用于存储有关第二存储体的故障位信息。

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