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Semiconductor memory device including post package repair control circuit and post package repair method
Semiconductor memory device including post package repair control circuit and post package repair method
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机译:半导体存储器件,包括后封装修复控制电路和后封装修复方法
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摘要
Provided are a semiconductor memory device having a post package repair control circuit and a post package repair method. In the semiconductor memory device and the post package repair method, in a post package repair mode, a second memory bank is used as a fail bit map memory for storing failed bit information regarding a first memory bank, and the first memory bank is used as a fail bit map memory for storing failed bit information regarding the second memory bank.
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