首页> 外国专利> METHOD FOR FORMING THROUGH HOLE ON SUPPORT PLATE, HOLED SUPPORT PLATE, AND METHOD FOR MANUFACTURING HOLED SUPPORT PLATE

METHOD FOR FORMING THROUGH HOLE ON SUPPORT PLATE, HOLED SUPPORT PLATE, AND METHOD FOR MANUFACTURING HOLED SUPPORT PLATE

机译：在支撑板上形成贯穿孔的方法，hold支撑板上以及制造hold支撑板上的方法

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摘要

PROBLEM TO BE SOLVED: To inexpensively form a through hole on a support plate.;SOLUTION: A holed support plate 10 has through holes 26 at a portion where a fist groove 12 formed on one surface 10₁ out of front and rear surfaces intersects with a second groove 14 formed on the other surface 10₂.;COPYRIGHT: (C)2009,JPO&INPIT

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公开/公告号JP2008258418A

专利类型
公开/公告日2008-10-23

原文格式PDF
申请/专利权人 TOKYO OHKA KOGYO CO LTD;
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申请/专利号JP20070099358
发明设计人 OYA TETSUSHI;
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申请日2007-04-05
分类号H01L21/683;
国家 JP
入库时间 2022-08-21 20:24:12

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