首页> 外国专利> Ultra thin Hf-silicate film growth by atomic layer chemical vapor deposition using a new combination of precursors: metal-alkylamide and metal-alkoxide

Ultra thin Hf-silicate film growth by atomic layer chemical vapor deposition using a new combination of precursors: metal-alkylamide and metal-alkoxide

机译:使用前体的新组合:金属-烷基酰胺和金属-醇盐通过原子层化学气相沉积法生长超薄H硅酸盐薄膜

摘要

An atomic layer deposition method using a new precursor combination without deterioration of reaction rate or requiring additional oxidizers, a new precursor combination used in the atomic layer deposition method, a Hf-silicate thin film prepared by the atomic layer deposition method using the new precursor combination, and a method for controlling a composition for the Hf-silicate thin film by using metal-alkoxide and metal-alkylamide are provided. A method for atomic layer chemical vapor deposition of a metal thin film comprises the steps of: introducing a metal-alkylamide precursor; purging the metal-alkylamide precursor; introducing a metal-alkoxide precursor; and purging the metal-alkoxide precursor. The metal is selected from the group consisting of hafnium, silicon, zirconium, titanium, and aluminum. The metal-alkylamide precursor is Hf(NRR')4 or Si(NRR')4, the metal-alkoxide precursor is Hf(OR)4 or Si(OR)4, and the metal thin film is Hf-silicate. An atomic layer chemical vapor deposition precursor for preparation of a Hf-silicate thin film comprises Hf-alkylamide and Si-alkoxide. An atomic layer chemical vapor deposition precursor for preparation of a Hf-silicate thin film comprises Si-alkylamide and Hf-alkoxide. A method for preparation of a metal thin film layer comprises preparing a metal thin film layer into which metals bonded to metal-akylamide are more added by alternately performing an atomic layer chemical vapor deposition process of the metal-alkylamide and the metal-alkoxide while purging metal-alkylamide and metal-alkoxide. A Hf-silicate thin film has a Hf/(Hf+Si) ratio of 0.3 to 0.8, and a dielectric constant of 8 to 18.
机译:使用新的前体组合而不会降低反应速率或需要额外的氧化剂的原子层沉积方法,用于原子层沉积方法的新的前体组合,通过使用新的前体组合的原子层沉积法制备的H硅酸盐薄膜提供了通过使用金属醇盐和金属烷基酰胺来控制Hf硅酸盐薄膜的组成的方法。一种用于金属薄膜的原子层化学气相沉积的方法,包括以下步骤:引入金属-烷基酰胺前体;净化金属-烷基酰胺前体;引入金属醇盐前体;并净化金属醇盐前体。所述金属选自ha,硅,锆,钛和铝。金属-烷基酰胺前体是Hf(NRR')4或Si(NRR')4,金属-烷氧化物前体是Hf(OR)4或Si(OR)4,金属薄膜是Hf-硅酸盐。用于制备Hf-硅酸盐薄膜的原子层化学气相沉积前体包括Hf-烷基酰胺和Si-醇盐。用于制备Hf-硅酸盐薄膜的原子层化学气相沉积前体包括Si-烷基酰胺和Hf-醇盐。一种金属薄膜层的制备方法,其包括制备金属薄膜层,通过在清洗的同时交替进行金属烷基酰胺和金属醇盐的原子层化学气相沉积工艺,在金属薄膜层中进一步添加与金属烷基酰胺键合的金属。金属烷基酰胺和金属醇盐。 Hf硅酸盐薄膜的Hf /(Hf + Si)比为0.3至0.8,介电常数为8至18。

著录项

  • 公开/公告号KR100760962B1

    专利类型

  • 公开/公告日2007-09-21

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20060023679

  • 发明设计人 용기중;김재현;

    申请日2006-03-14

  • 分类号C23C16;

  • 国家 KR

  • 入库时间 2022-08-21 20:31:16

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