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ALUMINUM AND COPPER BIMETALLIC BOND PAD SCHEME FOR COPPER DAMASCENE INTERCONNECTS
ALUMINUM AND COPPER BIMETALLIC BOND PAD SCHEME FOR COPPER DAMASCENE INTERCONNECTS
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机译:铜和铜相互连接的铝和铜双金属粘结垫方案
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摘要
ALUMINIUM AND COPPER BIMETALLIC BOND PAD SCHEME FOR COPPERDAMASCENE INTERCONNECTS ABSTRACT Improved processes for fabricating wire bond pads onpure copper damascene are disclosed by this invention. Theinvention relates to various methods of fabrication used forsemiconductor integrated circuit devices, and morespecifically to the formation of Al-Cu alloy top pad metallayers are described, which improve adhesion among thewire bond, top Al-Cu and the underlying copper padmetallurgy. This invention describes processes wherein aspecial Al-Cu bond layer or region is placed on top of theunderlying copper pad metal. This Al-Cu bond pad on purecopper (with barrier layer in-between) provides for improvedwire bond adhesion to the bond pad and prevents peelingduring wire bond adhesion tests.Figure 3b
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