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ALUMINUM AND COPPER BIMETALLIC BOND PAD SCHEME FOR COPPER DAMASCENE INTERCONNECTS

机译:铜和铜相互连接的铝和铜双金属粘结垫方案

摘要

ALUMINIUM AND COPPER BIMETALLIC BOND PAD SCHEME FOR COPPERDAMASCENE INTERCONNECTS ABSTRACT Improved processes for fabricating wire bond pads onpure copper damascene are disclosed by this invention. Theinvention relates to various methods of fabrication used forsemiconductor integrated circuit devices, and morespecifically to the formation of Al-Cu alloy top pad metallayers are described, which improve adhesion among thewire bond, top Al-Cu and the underlying copper padmetallurgy. This invention describes processes wherein aspecial Al-Cu bond layer or region is placed on top of theunderlying copper pad metal. This Al-Cu bond pad on purecopper (with barrier layer in-between) provides for improvedwire bond adhesion to the bond pad and prevents peelingduring wire bond adhesion tests.Figure 3b
机译:铜的铝和铜双金属粘结垫方案DAMASCENE互连 抽象 改进的在其上制造焊线垫的工艺本发明公开了纯铜镶嵌。的本发明涉及用于半导体集成电路器件等专门用于形成铝铜合金顶垫金属描述了各层,这些层改善了引线键合,顶部Al-Cu和下面的铜垫冶金。本发明描述了其中特殊的Al-Cu键合层或区域放置在底层铜垫金属。这种纯铜的Al-Cu键垫铜(中间有阻挡层)可改善引线键合到键合垫上并防止剥离在引线键合粘合力测试中。图3b

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