首页> 外国专利> With resistive foil layer, and the method of manufacturing the resistive layer with a copper foil, and copper-clad laminate or with resistive circuit printed wiring board using the copper foil with the resistance layer, and a resistor with its copper foil resistive layer production method with a circuit printed wiring board

With resistive foil layer, and the method of manufacturing the resistive layer with a copper foil, and copper-clad laminate or with resistive circuit printed wiring board using the copper foil with the resistance layer, and a resistor with its copper foil resistive layer production method with a circuit printed wiring board

机译：具有电阻箔层，以及具有铜箔的电阻层的制造方法，覆铜层压板或使用具有电阻层的铜箔和具有铜箔电阻层的电阻器的电阻电路印刷线路板的制造方法带有电路印刷线路板

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摘要

PROBLEM TO BE SOLVED: To provide a copper foil with a resistance layer which can obtain a dispersion-free high sheet resistance required of a printed wiring board with a resistance circuit, has a resistance layer with a small change in TCR (temperature coefficient of resistance), and is excellent in total balance.;SOLUTION: In the copper foil with a resistance layer formed on its one side, the resistance layer is made of a nickel-tin-phosphorus ternary alloy (e.g. one comprising 19-80 wt% nickel, 19-80 wt% tin, and 1-12 wt% phosphorus).;COPYRIGHT: (C)2004,JPO

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公开/公告号JP3891565B2

专利类型
公开/公告日2007-03-14

原文格式PDF
申请/专利权人三井金属鉱業株式会社;
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申请/专利号JP20020336317
发明设计人武者信一;百武正浩;妙中咲子;土橋誠;
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申请日2002-11-20
分类号C25D7/06;C23F1;C23F1/02;C23F1/18;C25D3/56;C25D3/60;H05K1/16;H05K3/06;
国家 JP
入库时间 2022-08-21 21:09:08

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