首页> 外国专利> Chip, has substrate with substrate surface having stress dependence of performance of electrical component, inclined area with area surface having another stress dependence of performance of component, where two dependences are different

Chip, has substrate with substrate surface having stress dependence of performance of electrical component, inclined area with area surface having another stress dependence of performance of component, where two dependences are different

机译：芯片，具有基板，该基板的表面与电气部件的性能有应力相关性，具有面积的倾斜区域的面积与部件的性能有另一种应力相关性，其中两个相关性不同

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摘要

The chip has a substrate with a substrate surface (13) having stress dependence of performance of an electrical component. An inclined area has an area surface having another stress dependence of performance of the component, where the dependences are different. A unit has a doped zone in the area, where the doping of the zone is larger than base doping of the substrate. A contacting structure contacts the zone in the area.

机译：该芯片具有基板，该基板具有基板表面（13），该基板表面（13）具有与电子部件的性能有关的应力依赖性。倾斜区域具有面积表面，该面积表面具有部件性能的另一应力依赖性，其中该依赖性是不同的。单元在该区域中具有掺杂区，其中该区的掺杂大于衬底的基础掺杂。接触结构接触该区域中的区域。

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公开/公告号DE102005008772A1

专利类型
公开/公告日2006-09-07

原文格式PDF
申请/专利权人 INFINEON TECHNOLOGIES AG;
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申请/专利号DE20051008772
发明设计人 AUSSERLECHNER UDO;
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申请日2005-02-25
分类号H01L23/58;H01L27/085;
国家 DE
入库时间 2022-08-21 21:20:23

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