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Continuing, the laser hole opening device and the method of using the depth of focus which is optimized
Continuing, the laser hole opening device and the method of using the depth of focus which is optimized
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机译：接续，激光开孔装置和使用聚焦深度的方法进行了优化
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摘要
The method of adjusting depth of focus with the laser cutting device, in order the laser beam which possesses the focal plane (107) process and processed ones which are formed (112) the surface the focal plane in the point which is crossed to be bleached in the laser beam Manaka of hole opening processing, processed ones (112) includes with the process which maintains fixed ablation speed on the exposure aspect processed ones (112) due to process and processed ones and adjusts at least the portion of one side among the focal planes positioning on the focal plane.
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