首页> 外国专利> This application (cross-reference of the relevant application) to a method and system of heat treatment and support of the workpiece is the United States Provisional Application No. filed May 8, 2003 and 60 / 434,670 United States Patent Application No. filed December 20, 2002 I want to claim the benefit of priority under 60 / 468,659. These applications are intended to be incorporated herein by reference herein.

This application (cross-reference of the relevant application) to a method and system of heat treatment and support of the workpiece is the United States Provisional Application No. filed May 8, 2003 and 60 / 434,670 United States Patent Application No. filed December 20, 2002 I want to claim the benefit of priority under 60 / 468,659. These applications are intended to be incorporated herein by reference herein.

机译：本申请（相关申请的交叉引用）是热处理和支撑工件的方法和系统，是2003年5月8日提交的美国临时申请和12月20日提交的60 / 434,670美国专利申请。，2002年，我想要求60 / 468,659下的优先权。这些申请旨在通过引用并入本文。

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摘要

This is a method workpiece, and equipment, for example to support, such as a semiconductor wafer. While supporting the workpiece, the support system is configured to allow movement of the workpiece to be thermally induced. Geto songs and thermal bowing due to heat will be included in this exercise. Includes a support member having a movable contact part can contact with the workpiece, and the contact portion, while supporting the workpiece, the support system is movable so as to permit movement of the workpiece to be thermally induced. The movable contact portion includes a plurality of movable contact portions of the plurality of support members, the contact portion is elastically contactable with the workpiece. The support member may comprise a non-restraining portion movable contact portion includes a flexible plurality of support members, each and having a restricting portion and the non-binding portion. Alternatively, may be a rigid, force application devices of the plurality, for example, the support system may include a spring or the like coupled to the support member supporting member.

机译：这是例如用于支撑的方法工件和设备，例如半导体晶片。在支撑工件时，支撑系统构造成允许工件的运动被热诱导。此练习中将包括Geto歌曲和由于热而引起的热弯曲。包括具有可移动的接触部分的支撑构件，该可移动的接触部分可以与工件接触，并且该接触部分在支撑工件的同时，该支撑系统是可移动的，从而允许工件被热诱导运动。可动接触部分包括多个支撑构件的多个可动接触部分，该接触部分可与工件弹性接触。支撑构件可包括非约束部分，可动接触部分包括柔性的多个支撑构件，每个支撑构件均具有限制部分和非约束部分。替代地，可以是多个刚性的力施加装置，例如，支撑系统可以包括联接至支撑构件支撑构件的弹簧等。

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公开/公告号JP2006511970A

专利类型
公开/公告日2006-04-06

原文格式PDF
申请/专利权人マトソンテクノロジーカナダインコーポレイテッド;
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申请/专利号JP20050502515
发明设计人カム、デビッド、マルコム;センペレ、ギヨーム;カルドジェルシク、リュボミル;スチュアート、グレゴリー;バンブロヴィク、ムラデン;トラン、ティム;ジェツ、セルギー;コマサ、トニー;ルドルフ、マーク;シベール、ジョセフ;
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申请日2003-12-19
分类号H01L21/26;
国家 JP
入库时间 2022-08-21 21:50:51

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