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BONDING APPARATUS FOR BONDING AN ANISOTROPIC CONDUCTIVE FILM AND A CIRCUIT BOARD IN A FLAT PANEL DISPLAY TO IMPROVE BONDING QUALITY AND EFFICIENCY IN WORK PROCESSES
BONDING APPARATUS FOR BONDING AN ANISOTROPIC CONDUCTIVE FILM AND A CIRCUIT BOARD IN A FLAT PANEL DISPLAY TO IMPROVE BONDING QUALITY AND EFFICIENCY IN WORK PROCESSES
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机译：用于在平板显示器中粘合各向异性导电膜和电路板的粘合装置，以提高工作过程中的粘合质量和效率
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摘要
PURPOSE: A bonding apparatus for bonding an anisotropic conductive film and a circuit board in a flat panel display is provided to improve bonding quality and efficiency in work processes by making the film and the circuit board easily bonded onto glass by using one equipment. CONSTITUTION: A film bonding part(4) installed on a work stand(2) bonds an anisotropic conductive film(F) onto glass(G). A circuit board bonding part(6) sets and bonds a circuit board(B) on the glass at the work stand. The film bonding part includes a turn table(T1) rotatably installed at the work stand, a loading state(12) which is installed at the turn table and loads the glass and a film bonding unit(14) for bonding the film onto the glass. The circuit board bonding part includes a turn table(T2), a loading unit(24) for loading the glass, a setting unit(26) for setting the circuit board on the loaded glass and a board bonding unit(28) for bonding the set circuit board onto the glass.
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