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APPARATUS FOR BONDING ANISOTROPIC CONDUCTIVE FILM AND DRIVING CHIP OF FLAT PANEL DISPLAY TO IMPROVE WORKING EFFICIENCY AND BONDING QUALITY
APPARATUS FOR BONDING ANISOTROPIC CONDUCTIVE FILM AND DRIVING CHIP OF FLAT PANEL DISPLAY TO IMPROVE WORKING EFFICIENCY AND BONDING QUALITY
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机译：用于粘合各向异性导电膜和驱动平板显示器的芯片以提高工作效率和粘合质量的装置
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摘要
PURPOSE: An apparatus for bonding an anisotropic conductive film and a driving chip of a flat panel display is provided to remarkably improve working efficiency by sequentially bonding the anisotropic conductive film and the driving chip using a single apparatus and to improve bonding quality by setting the driving chip at an optimized position in response to the position of a loaded glass. CONSTITUTION: An apparatus for bonding an anisotropic conductive film and a driving chip includes a working table(2), a rotary table(4), loading units(6) fixed to the rotary table, a film bonding part(8) that is mounted on the working table and bonds the anisotropic conductive film to a glass(G) loaded on the loading units, a chip setting part(10) for setting the driving chip on the glass, and a chip bonding part(12) for bonding the driving chip set on the glass. The chip setting part includes an alignment unit for aligning the driving chip, a setting unit for transferring the aligned driving chip to a chip setting region and setting the driving chip on a glass pattern, and a scanning unit for scanning the positions of the glass and driving chip.
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