首页> 外国专利> METHOD FOR MANUFACTURING LOW TEMPERATURE POLYCRYSTALLINE SILICON TFT-LCD ARRAY SUBSTRATE USING FALC PROCESS, PARTICULARLY REGARDING TO REDUCING METAL IMPURITIES AFTER CRYSTALLIZATION AND MINIMIZING CRYSTALLIZATION DEFECT

METHOD FOR MANUFACTURING LOW TEMPERATURE POLYCRYSTALLINE SILICON TFT-LCD ARRAY SUBSTRATE USING FALC PROCESS, PARTICULARLY REGARDING TO REDUCING METAL IMPURITIES AFTER CRYSTALLIZATION AND MINIMIZING CRYSTALLIZATION DEFECT

机译:一种利用FAC工艺制造低温多晶硅硅TFT-LCD阵列基板的方法,特别是在结晶化和最小化结晶化缺陷后降低金属杂质的方法

摘要

PURPOSE: A method for manufacturing a low temperature polycrystalline silicon TFT-LCD array substrate using an FALC(Field Aided lateral Crystallization) process is provided to reduce metal impurities after crystallization by reducing a use amount of a metal material and minimize a crystallization defect by optimizing strength and direction of an electric field in a channel area when power supply is applied. CONSTITUTION: In manufacturing an amorphous silicon TFT-LCD(Thin Film Transistor-Liquid Crystal Display) array substrate, a metal layer which is a crystallization catalyst is selectively deposited at a source area or drain area of an amorphous silicon thin film. Negative power supply is applied to the selected area of the amorphous silicon thin film. Mutually facing surfaces of source and drain electrodes(130,140) of each TFT(100) are formed in a convex shape.
机译:目的:提供一种使用FALC(场辅助横向结晶)工艺制造低温多晶硅TFT-LCD阵列基板的方法,以通过减少金属材料的使用量来减少结晶后的金属杂质,并通过优化来最小化结晶缺陷施加电源时通道区域中电场的强度和方向。构成:在制造非晶硅TFT-LCD(薄膜晶体管液晶显示器)阵列基板时,作为结晶催化剂的金属层选择性沉积在非晶硅薄膜的源区或漏区。负电源施加到非晶硅薄膜的选定区域。每个TFT(100)的源电极(130)和漏电极(130)的相互面对的表面形成为凸形。

著录项

  • 公开/公告号KR20050008016A

    专利类型

  • 公开/公告日2005-01-21

    原文格式PDF

  • 申请/专利权人 HANYANG HAK WON CO. LTD.;

    申请/专利号KR20030047688

  • 发明设计人 KIM YOON SU;CHOI DUCK KYUN;

    申请日2003-07-14

  • 分类号G02F1/136;

  • 国家 KR

  • 入库时间 2022-08-21 22:06:01

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