首页>
外国专利>
SEMICONDUCTOR WAFER MANUFACTURING METHOD, SEMICONDUCTOR WAFER MANUFACTURING ORDER ACCEPTANCE METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING ORDER ACCEPTANCE SYSTEM
SEMICONDUCTOR WAFER MANUFACTURING METHOD, SEMICONDUCTOR WAFER MANUFACTURING ORDER ACCEPTANCE METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING ORDER ACCEPTANCE SYSTEM
展开▼
机译：半导体晶片制造顺序接受方法，半导体晶片制造顺序接受系统，半导体晶片制造顺序接受系统
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention provides a method for manufacturing a semiconductor wafer comprising steps of obtaining information of a device manufacturing process, selecting a wafer manufacturing process corresponding thereto, and manufacturing a semiconductor wafer according to the selected wafer manufacturing process. The present invention also provides a method for receiving an order for manufacture of a semiconductor wafer comprising a step of connecting a device maker with a customer computer in a wafer maker, a step wherein the customer computer receives information of a device manufacturing process and a step of selecting a wafer manufacturing process corresponding thereto, and provides a system for receiving an order for manufacture of a semiconductor wafer comprising a client terminal in a device maker and a customer computer in a wafer maker wherein information of a device manufacturing process is inputted into the client terminal and is sent, the customer computer receives the information of the device manufacturing process, and a wafer manufacturing process corresponding thereto is selected. Thereby, there can be provided a method for manufacturing a semiconductor wafer, a method for receiving an order for manufacture of a semiconductor wafer, and a system for receiving an order wherein a wafer suitable for a device manufacturing process in a device maker is supplied.
展开▼
