首页>
外国专利>
New mode and new combined device for the implementation of a pre- and post-soldering controlled martensis-free soldering process with controlled soldering temperature
New mode and new combined device for the implementation of a pre- and post-soldering controlled martensis-free soldering process with controlled soldering temperature
展开▼
机译:新的模式和新的组合设备,用于在焊接温度受控的情况下实施焊接前和焊接后受控的无焊工艺
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention (Figure 1) relates to a new formula-controlled method of joining by brazing a connecting piece with a workpiece where the temperature is controlled during all phases of the process before, during and after the brazing temperature phase so that adverse structural changes of the work material (martensite formation) after brazing are eliminated while also minimising energy consumption and process insecurity. Furthermore, a device for the execution of the method.
展开▼