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Solder interface locking using unidirectional growth of an intermetallic compound
Solder interface locking using unidirectional growth of an intermetallic compound
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机译：使用金属间化合物的单向生长进行焊接界面锁定
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摘要
A ball grid array device includes a substrate, further including a first major surface and a second major surface. An array of pads is positioned on one of the first major surface or the second major surface. At least some of the pads include a barrier layer having pores or openings therein. When solder is placed on the pad, the barrier layer forms an intermetallic compound at a rate different from the rate of the intermetallic compound formed between the pad and the solder. The result is a solder ball on a pad that has a first intermetallic compound and a second intermetallic compound.
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