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The ultrathin metal film, the ultrathin multi-layer metal film, and method for the production of the ultrathin metal film or the ultrathin, multilayer metal film

机译:超薄金属膜,超薄多层金属膜以及制造超薄金属膜或超薄多层金属膜的方法

摘要

The present invention relates to an ultra-thin metal film, an ultra-thin metal multilayer film, and a method of fabricating an ultra-thin metal film or an ultra-thin metal multilayer film. The ultra-thin metal film and the ultra-thin metal multilayer film can be obtained by forming a dielectric film on a conductive base material in a film thickness that causes the significant tunneling effect between metals through the thin dielectric film, or a film thickness whereby the valence electrons and holes of the metal composing the metallic base material and the ultra-thin metal film are affected by the many-body effects, for example, in a film thickness wherein the band-gap width of said dielectric is narrowed; and the ultra-thin metal films are formed on the dielectric grown in the layer-by-layer mode by the deposition method. According to the present invention, an ultra-thin metal film or a film wherein ultra-thin metal films are multilayered can be obtained without forming clusters, and the present invention can be applied for the extension of the life of catalysts, the densification of integrated circuits and the like. IMAGE
机译:超薄金属膜,超薄金属多层膜和制造超薄金属膜或超薄金属多层膜的方法技术领域本发明涉及超薄金属膜,超薄金属多层膜以及制造超薄金属膜或超薄金属多层膜的方法。超薄金属膜和超薄金属多层膜可以通过在导电性基材上形成介电膜而形成,该介电膜的膜厚会引起通过介电膜的金属之间的显着的隧道效应,或者其膜厚为膜厚。构成金属基材和超薄金属膜的金属的价电子和空穴受到多体效应的影响,例如在使所述电介质的带隙宽度变窄的膜厚中。通过沉积方法在逐层生长的电介质上形成超薄金属膜。根据本发明,可以得到超薄金属膜或将超薄金属膜多层化的膜而不会形成团簇,并且本发明可以用于延长催化剂的寿命,提高整体的致密性。电路等。 <图像>

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