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Porous material formation by chemical vapor deposition onto colloidal crystal templates

机译:通过化学气相沉积到胶体晶体模板上形成多孔材料

摘要

Methods and systems are disclosed for fabricating ultra-low dielectric constant porous materials. In one aspect of the invention, a method for making porous low-k films is disclosed. The method uses polymer based porogens as sacrificial templates around which a chemical vapor deposition (CVD) or plasma enhanced chemical vapor deposition (PECVD) deposited matrix is formed. Upon pyrolysis, the porogens decompose resulting in a porous ultra-low dielectric material. This method can be used, for example, to produce porous organosilicate glass (OSG) materials, ultra-low dielectric nanoporous materials, porous ceramics, porous scaffolds, and/or porous metals. Various uses and embodiments of the methods and systems of this invention are disclosed.
机译:公开了用于制造超低介电常数多孔材料的方法和系统。在本发明的一个方面,公开了一种制造多孔低k膜的方法。该方法使用基于聚合物的致孔剂作为牺牲模板,在其周围形成化学气相沉积(CVD)或等离子体增强化学气相沉积(PECVD)沉积的基质。热解后,致孔剂分解,形成多孔的超低介电材料。例如,该方法可用于生产多孔有机硅玻璃(OSG)材料,超低介电纳米多孔材料,多孔陶瓷,多孔支架和/或多孔金属。公开了本发明的方法和系统的各种用途和实施例。

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