Three-dimensional stacked heat spreader assembly for electronic package and method for assembling

• 1. 一种基于三维堆叠气密封装的TR组件及组装方法 [P] . 中国专利： CN113838845B . 2022.02.11
• 2. 一种基于三维堆叠气密封装的TR组件及组装方法 [P] . 中国专利： CN113838845A . 2021-12-24
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  机译： 散热器，包括散热器的电子封装件以及制造散热器的方法

• 4. SUPPORTING MEMBER FOR ELECTRONIC PACKAGE ASSEMBLY, AND SYSTEM AND METHOD FOR ASSEMBLING ELECTRONIC PACKAGE ASSEMBLY HAVING THE MEMBER [P] . 日本专利： JP2002329826A . 2002-11-15

  机译： 用于电子包装组件的支撑构件以及用于组装具有该构件的电子包装组件的系统和方法

• 5. SEMICONDUCTOR PACKAGE STACK STRUCTURE HAVING A HEAT SPREADER AND SEMICONDUCTOR PACKAGE MOUNT STRUCTURE HAVING THE SAME [P] . 韩国专利： KR20130081993A . 2013-07-18

  机译： 具有散热器的半导体封装堆栈结构和具有相同结构的半导体封装安装结构

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