ADVANCED PROCESS CONTROL (APC) OF COPPER THICKNESS FOR CHEMICAL MECHANICAL PLANARIZATION(CMP) OPTIMIZATION

• 1. 用于铜和硅通孔（TSV）应用的化学机械平面化（CMP）组合物及其方法 [P] . 中国专利： CN109401631A . 2019-03-01
• 2. 用于制造化学机械平面化（CMP）抛光垫的无气雾化方法 [P] . 中国专利： CN108115555A . 2018-06-05
• 3. Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization [P] . 美国专利： US6630360B2 . 2003-10-07

  机译： 铜厚度的高级过程控制（APC）用于化学机械平面化（CMP）优化

• 4. ADVANCED PROCESS CONTROL (APC) OF COPPER THICKNESS FOR CHEMICAL MECHANICAL PLANARIZATION(CMP) OPTIMIZATION [P] . AU2002367053A1 . 2003-07-30

  机译： 铜厚度的先进过程控制（APC）用于化学机械平面化（CMP）优化

• 5. Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization [P] . 美国专利： US2003129774A1 . 2003-07-10

  机译： 铜厚度的高级过程控制（APC）用于化学机械平面化（CMP）优化

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• 2. Harmony search algorithm with differential evolution based control parameter co-evolution and its application in chemical process dynamic optimization [J] . 范勤勤, 王循华, 颜学峰 中南大学学报（英文版） . 2015,第006期
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• 4. Process optimization and consumable development for Chemical Mechanical Planarization (CMP) processes [D] . Mudhivarthi, Subrahmanya R. 2007
• 5. Economic-Oriented Stochastic Optimization in Advanced Process Control of Chemical Processes [O] . László Dobos, András Király, János Abonyi 2012
• 6. Direct Measurement Of Planarization Length For Copper Chemical Mechanical Planarization Polishing (cmp) Processes Using A Large Pattern Test Mask [O] . Paul Lefevre Albert, Albert Gonzales, Tom Brown, 2007

• 1. Chemical Mechanical Planarization (CMP) for Microelectronic Applications [J] . Li Yuzhuo . 合成化学 . 2004,第0z1期
• 2. IMPROVING THE MECHANICAL PROPERTIES OF COPPER ALLOYS BY THERMO-MECHANICAL PROCESSING [J] . M.C.Somani ,L.P.Karjalainen . 金属学报：英文版 . 2004,第2期
• 3. Harmony search algorithm with differential evolution based control parameter co-evolution and its application in chemical process dynamic optimization [J] . 范勤勤 ,王循华 ,颜学峰 . 中南大学学报 . 2015,第006期
• 4. 基于田口方法的300mm晶圆铜化学机械抛光工艺优化研究 [C] . WANG Tongqing ,王同庆 ,ZHAO Dewen . 2013年海峡两岸平坦化技术研讨会 . 2013
• 5. 化学机械研磨(CMP)对电特性影响的分析与优化 [A] . 姜霖 . 2011