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STENCIL MASK AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURED BY USING THE SAME STENCIL MASK, AND ITS MANUFACTURING METHOD
STENCIL MASK AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURED BY USING THE SAME STENCIL MASK, AND ITS MANUFACTURING METHOD
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机译：模板框及其制造方法，使用相同模板框制造的半导体装置及其制造方法
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摘要
PROBLEM TO BE SOLVED: To provide a stencil mask which can practically be applied with pattern correction and is manufactured by performing the correction in a relatively short time although the conventional pattern correction of the stencil mask using finite element method stress analysis requires an unpracticable and unrealistic processing time since object stencil holes are very many.;SOLUTION: When stencil mask pattern data are corrected by stress analysis, a displacement quantity is calculated by using stencil holes larger than specific size among respective stencil patterns. Consequently, stencil mask pattern data having a pattern having been correct in an industrially applicable relatively-short time are obtained and then the stencil mask having a desired pattern formed can be obtained by being manufactured according to the pattern.;COPYRIGHT: (C)2003,JPO
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