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首页> 外国专利> RELIABILITY EVALUATING AND TESTING DEVICE, RELIABILITY EVALUATING AND TESTING SYSTEM, CONTACTOR, AND RELIABILITY EVALUATING AND TESTING METHOD

RELIABILITY EVALUATING AND TESTING DEVICE, RELIABILITY EVALUATING AND TESTING SYSTEM, CONTACTOR, AND RELIABILITY EVALUATING AND TESTING METHOD

机译：可靠性评估与测试设备，可靠性评估与测试系统，接触器以及可靠性评估与测试方法

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PROBLEM TO BE SOLVED: To provide a reliability evaluating and testing device and testing system, a contactor, and a reliability evaluating and testing method by which the reliability of a semiconductor element can be evaluated and tested quickly, efficiently, and highly reliably on a wafer level and, at the same time, the labor and cost required for the evaluation and tests can be reduced remarkably.;SOLUTION: The reliability evaluating and testing device 10 is provided with an airtight heat-insulating wafer housing section, which houses a wafer W in a state where the electrode pads of a plurality of devices formed on the wafer W are collectively brought into electrical contact with the bumps of the contactor 11, and transmits and receives test signals to and from a measuring section 15. The wafer housing section has a pressing mechanism 13 which presses the contactor 11 against the wafer W and a heating mechanism 14 which directly heats the wafer W collectively brought into contact with the contactor 11 by means of the pressing mechanism 13 to a prescribed high temperature. The device 10 evaluates the reliability of wiring and insulating films formed on the wafer W under an accelerating condition.;COPYRIGHT: (C)2003,JPO
机译：解决的问题：提供可靠性评估和测试设备，测试系统，接触器以及可靠性评估和测试方法，通过该评估和测试系统，可以在晶片上快速，高效且高度可靠地评估和测试半导体元件的可靠性。级别，并且同时可以显着减少评估和测试所需的人工和成本。解决方案：可靠性评估和测试装置10设有一个气密的隔热晶片容纳部分，该部分容纳晶片W在形成于晶片W上的多个装置的电极焊盘集中地与接触器11的凸块电接触的状态下，向测量部15收发测试信号。压紧机构13将接触器11压向晶片W，加热机构14直接加热共同接触晶片W的晶片W。接触器11通过加压机构13达到规定的高温。装置10评估在加速条件下形成在晶片W上的布线和绝缘膜的可靠性。版权所有：（C）2003，JPO

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