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The electrode structure which possesses the Bi stratified ferroelectric thin film, the formation manner and ferroelectric thin film memory device

机译:具有Bi分层铁电薄膜的电极结构,形成方法及铁电薄膜存储装置

摘要

PROBLEM TO BE SOLVED: To control a Bi laminar ferroelectric thin film formed on an Ir oxide layer in crystalline orientation by a method wherein a Ti silicide layer, an Ir-Ti alloy layer, a Ti layer, and a crystalline Ir oxide layer are successively provided between a metal layer and the Bi laminar ferroelectric thin film in this sequence. SOLUTION: An electrode structure with a Bi laminar dielectric thin film is equipped with an insulating film 12, a polysilicon layer 14, a Ti silicide layer 16, an Ir-Ti alloy layer 18, an Ir layer 20, a crystalline Ir oxide layer 22, and a Bi laminar ferromagnetic thin film 24 which are formed on a semiconductor substrate. The N-type polysilicon layer 14, the Ti silicide layer 16, the Ir-Ti alloy layer 18, the Ir layer 20, and the crystalline Ir oxide layer 22 are successively provided between the metal layer 14 and the Bi laminar ferroelectric thin film 24. An Ir oxide having plane orientations of (200) and (110) is used as the crystalline Ir oxide layer 22. For instance, a BIT thin film is used as the Bi laminar ferroelectric thin film 24.
机译:解决的问题:通过以下方法控制形成在Ir氧化物层上的Bi层状铁电薄膜的晶体取向:通过依次层叠Ti硅化物层,Ir-Ti合金层,Ti层和晶体Ir氧化物层的方法在金属层和Bi层状铁电薄膜之间按此顺序设置。解决方案:具有Bi层状电介质薄膜的电极结构配备有绝缘膜12,多晶硅层14,硅化钛层16,Ir-Ti合金层18,Ir层20,晶体Ir层22以及在半导体基板上形成的Bi层状强磁性薄膜24。在金属层14与Bi层状铁电薄膜24之间依次设有N型多晶硅层14,硅化钛层16,Ir-Ti合金层18,Ir层20以及结晶性Ir氧化物层22。具有(200)和(110)的平面取向的Ir氧化物用作结晶I​​r氧化物层22。例如,将BIT薄膜用作Bi层状铁电薄膜24。

著录项

  • 公开/公告号JP3386339B2

    专利类型

  • 公开/公告日2003-03-17

    原文格式PDF

  • 申请/专利权人 沖電気工業株式会社;

    申请/专利号JP19970185485

  • 发明设计人 足利 欣哉;

    申请日1997-07-10

  • 分类号H01L27/105;H01L21/8247;H01L29/788;H01L29/792;

  • 国家 JP

  • 入库时间 2022-08-22 00:22:05

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